WECOBA® S
COPPER ALLOY
WECOBA® S exhibits a defined set of mechanical and physical properties focused on hardness and electrical conductivity. The alloy integrates characteristics of two copper-nickel-silicon systems and forms a distinct material class.
RESISTANCE WELDING | ELECTRODES | PLUNGER TIPS | PLASTIC INJECTION MOLDS | METAL CASTING
Key Features
Excellent electrical and thermal conductivity
High strength and hardness
High thermal stability at elevated temperatures
Good corrosion resistance
Beryllium- free (alternative to Beryllium Products such as CuCoNiBe…)
Chemical Composition nominal
Deviations may occur to achieve specific product characteristics.
Ni NICKEL | Si SILICON | Cr CHROMIUM | Cu COPPER |
2.4 | 0.7 | 0.4 | balance |
EN |
| DIN | UNS | RWMA |
~CW111C ~CuNi2Si | ~CW112C ~CuNi3Si | ~2.0855 ~2.0857 | C18000 C70250 | Class 3
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Typical Application
Aluminum die casting cold-chamber process
Resistance Welding
Plastic Injection Mould making
Moulds for the metal industry
Typical Components
Core inserts for injection moulding tools
Plunger tips
Electrodes and holders for resistance welding processes
Spot welding and seam welding electrodes
Various applications for heat dissipation
Physical and Mechanical Properties nominal
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| FORGED | EXTRUDED | ||
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| DIA 6-25mm | DIA 26-50mm | DIA 51-120mm |
Tensile strength Rm | (MPa) | 659 | 682 | 668 | 660 |
Yield strength RP0.2 | (MPa) | 512 | 518 | 517 | 507 |
Brinell hardness | (10/3000) | 222 | 211 | 207 | 207 |
Elongation A5 | (%) | 10 | 13 | 13 | 13 |
Elasticity modulus E | (GPa) | 135 |
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Density ρ | (g/cm³) | 8.8 |
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Thermal conductivity λ- 20°C | (W/m.K) | 204 |
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Electrical conductivity- 20°C | (% I.A.C.S.) | 51 |
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Electrical conductivity | (m/W*mm2) | 29 |
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Coefficient of thermal expansion α | (10-6/K) | 16.7 |
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The values provided are based on experience gained from production facilities, material manufacturers and our own investigations. They may vary due to production- and batch-related influences and therefore do not constitute a guarantee or a warranted property. For the evaluation of specific applications, we are pleased to provide support upon request. Binding statements or commitments are issued exclusively in written form by our technical team. Rev. 02/2026
