WECOBA® N
COPPER ALLOY
WECOBA® N represents a high-performance beryllium-free alloy with high hardness and strength and serves as a suitable alternative to CuBe2. In view of increasingly stringent regulations for beryllium-containing materials, WECOBA® N provides a safe efficient and future-oriented solution.
VARIOUS MOULDS PLASTIC INDUSTRY | FOOD INDUSTRY | CuBe2 ALTERNATIVE | BERYLLIUM-FREE
Key Features
Highest strength and hardness among beryllium-free alloys
Very good electrical and thermal conductivity
High thermal stability
Good corrosion resistance
Beryllium-free alternative to CuBe2
Chemical Composition nominal
Deviations may occur to achieve specific product characteristics.
Ni NICKEL | Si SILICON | Cr CHROMIUM | OTHERS | Cu COPPER |
7.0 | 2.1 | 0.9 | max. 0.5 | balance |
EN | DIN | UNS | RWMA |
WECOBA® Specification | Class 4 | ||
Typical Application
CuBe2 alternative
Plastic mould making
Moulds for the foundry industry
Typical Components
Core inserts and components for injection moulding tools
Blow moulding and thermoforming tools
Welding fixtures
Moulds for non-ferrous metal casting
Physical and Mechanical Properties nominal
|
| FORGED | EXTRUDED |
Tensile strength Rm | (MPa) | 804 | 930 |
Yield strength RP0.2 | (MPa) | 662 | 732 |
Brinell hardness | (10/3000) | 272 | 292 |
Elongation A5 | (%) | 4 | 5 |
Elasticity modulus E | (GPa) | 140 | 150 |
Density ρ | (g/cm³) | 8.7 |
|
Thermal conductivity λ- 20°C | (W/m.K) | 162 |
|
Electrical conductivity- 20°C | (% I.A.C.S.) | 40 |
|
Electrical conductivity | (m/W*mm2) | 20 |
|
Coefficient of thermal expansion α | (10-6/K) | 16.5 |
|
The values provided are based on experience gained from production facilities, material manufacturers and our own investigations. They may vary due to production- and batch-related influences and therefore do not constitute a guarantee or a warranted property. For the evaluation of specific applications, we are pleased to provide support upon request. Binding statements or commitments are issued exclusively in written form by our technical team. Rev. 02/2026
